The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Jan. 23, 2018
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventors:
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 5/06 (2006.01); C25D 3/46 (2006.01); C25D 3/64 (2006.01); C25D 7/00 (2006.01); H01R 13/03 (2006.01); C25D 7/06 (2006.01); H01R 4/18 (2006.01); C25D 3/12 (2006.01); C25D 5/12 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C22C 5/06 (2013.01); C25D 3/64 (2013.01); C25D 7/00 (2013.01); C25D 7/0607 (2013.01); H01R 4/184 (2013.01); C25D 3/12 (2013.01); C25D 3/46 (2013.01); C25D 5/12 (2013.01);
Abstract
A terminal plating material includes a metal substrate, and a silver-tin alloy plating layer containing a silver-tin alloy, arranged on the metal substrate. The silver-tin alloy plating layer contains an intermetallic compound of silver and tin, the Vickers hardness of the surface of the silver-tin alloy plating layer in the terminal plating material is 250 Hv or more, and the surface roughness of the silver-tin alloy plating layer is 0.60 μmRa or less. Further, a terminal is formed from the terminal plating material. A terminal-equipped electric wire includes the terminal. A wire harness includes the terminal-equipped electric wire.