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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10305018 B1

PDFFull Text
Date of Patent:
May. 28, 2019

Filed:

Oct. 12, 2016

Manufacturing method of electronic component

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jeong Ryeol Kim, Suwon-si, KR;

Bum Suk Kang, Suwon-si, KR;

Hyo Min Kang, Suwon-si, KR;

Hang Kyu Cho, Suwon-si, KR;

Chang Hoon Kim, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO, LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:

Morgan Lewis & Bockius LLP

Primary Examiner:

Minh Trinh

Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01L 41/047 (2006.01); H01C 7/00 (2006.01); H01C 7/10 (2006.01); H01C 17/28 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 37/00 (2006.01); H01F 41/10 (2006.01); H01G 4/008 (2006.01); H01G 4/30 (2006.01); H01L 41/273 (2013.01); H01C 1/148 (2006.01); H01C 7/18 (2006.01); H01G 4/232 (2006.01); H01L 41/293 (2013.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0478 (2013.01); H01C 1/148 (2013.01); H01C 7/008 (2013.01); H01C 7/10 (2013.01); H01C 7/18 (2013.01); H01C 17/28 (2013.01); H01C 17/283 (2013.01); H01F 27/2847 (2013.01); H01F 27/29 (2013.01); H01F 37/005 (2013.01); H01F 41/10 (2013.01); H01G 4/008 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01L 41/0472 (2013.01); H01L 41/0477 (2013.01); H01L 41/273 (2013.01); H01L 41/293 (2013.01); H01C 7/1006 (2013.01); H01F 17/0006 (2013.01); H01F 27/292 (2013.01); H01G 4/12 (2013.01);
Abstract

A manufacturing method of an electronic component includes forming a body including first and second internal electrodes respectively exposed from first and second end surfaces of the body and dielectric layers disposed between the first and second internal electrodes; applying, on the first and second end surfaces of the body, a paste containing a metal powder and first glass; and sintering the body and the paste to convert the paste to first and second external electrodes including crystalline metal particles having a polyhedral shape and second glass and respectively connected to the first internal electrodes and the second internal electrodes

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