The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Sep. 19, 2016
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zuqiang Wang, Beijing, CN;

Yuqing Yang, Beijing, CN;

Lujiang Huangfu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/77 (2017.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1218 (2013.01); H01L 21/77 (2013.01); H01L 23/31 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 27/12 (2013.01); H01L 27/1262 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05006 (2013.01); H01L 2924/36 (2013.01);
Abstract

Embodiments of the present invention provides an array substrate. The array substrate includes a display region and a packaging region. The packaging region includes a plurality of functional layers. And the packaging region further includes: a plurality of through holes running through at least one of the plurality of functional layers and configured to allow a packaging adhesive to enter therein; and a groove formed above at least some of the through holes, wherein, projection areas of the at least some of the through holes onto a base substrate of the array substrate are located within a projection area of the groove onto the base substrate. Embodiments of the present invention further provides a display panel and a display apparatus including the abovementioned array substrate, and a method of manufacturing the abovementioned array substrate.


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