The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Aug. 22, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Volker Strutz, Tegernheim, DE;
Rainer Markus Schaller, Saal a.d. Donau, DE;
Franz-Peter Kalz, Regensburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01); H01L 23/00 (2006.01); H01L 27/22 (2006.01); G01R 33/00 (2006.01); H01L 23/495 (2006.01); H01L 23/60 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); G01R 33/0052 (2013.01); H01L 23/4951 (2013.01); H01L 23/49506 (2013.01); H01L 23/49513 (2013.01); H01L 23/49548 (2013.01); H01L 23/60 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 27/22 (2013.01); H01L 23/49503 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/29561 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/85986 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/30101 (2013.01);
Abstract
A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 10Ω·cm and 10Ω·cm.