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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10304788 B1

PDFFull Text
Date of Patent:
May. 28, 2019

Filed:

Apr. 11, 2018

Semiconductor power module to protect against short circuit event

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Jihwan Kim, Seoul, KR;

Heeyoung Song, Bucheon, KR;

Gwigyeon Yang, Incheon, KR;

Olaf Zschieschang, Vaterstetten, DE;

Assignee:

Semiconductor Components Industries, LLC, Phoenix, AZ (US);

Attorney:

Brake Hughes Bellermann LLP

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/62 (2006.01); H01L 23/29 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/62 (2013.01); H01L 23/24 (2013.01); H01L 23/29 (2013.01); H01L 23/3157 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01);
Abstract

According to an aspect, a semiconductor power module includes a substrate, a semiconductor device coupled to the substrate, a bond wire coupled to the semiconductor device, and a first molding material layer disposed on the substrate. The first molding material layer encapsulates a first portion of the bond wire. The bond wire has a second portion disposed outside of the first molding material layer. The semiconductor power module includes a second molding material layer disposed on the first molding material layer. The second molding material layer encapsulates the second portion of the bond wire. The second molding material layer has a hardness less than a hardness of the second molding material layer.

Find Patent Forward Citations

Kim, Jihwan. (2019). Semiconductor power module to protect against short circuit event (U.S. Patent No. 10304788). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10304788

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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