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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10304770 B1

PDFFull Text
Date of Patent:
May. 28, 2019

Filed:

Feb. 07, 2018

Semiconductor device with stacked terminals

Applicant:

Tesla, Inc., Palo Alto, CA (US);

Inventors:

Wenjun Liu, Santa Clara, CA (US);

Robert James Ramm, Mountain View, CA (US);

Colin Kenneth Campbell, San Francisco, CA (US);

Assignee:

Tesla, Inc., Palo Alto, CA (US);

Attorneys:

Garlick & Markison

Bruce Garlick

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/02 (2006.01); H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/50 (2006.01); H01L 23/373 (2006.01); H01L 49/02 (2006.01); H01L 21/48 (2006.01); H01G 4/12 (2006.01); H01L 23/057 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01G 4/12 (2013.01); H01L 21/4825 (2013.01); H01L 23/057 (2013.01); H01L 23/3735 (2013.01); H01L 28/40 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 25/072 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37099 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/40 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor device includes housing, a substrate, a first semiconductor die, a second semiconductor die, a first terminal, and a second terminal. The first terminal in a first terminal plane couples to the first semiconductor die. The second terminal has a contact portion in a contact portion plane within the housing that couples to the second semiconductor die, a main portion in a main portion plane partially within the housing, the main portion plane substantially parallel to and offset from the first terminal plane, and the main portion plane substantially parallel to and offset from the contact portion plane, and an offsetting portion within the housing and that connects the contact portion to the main portion. At least some of the main portion of the second terminal overlaps the first terminal and the first terminal and the main portion of the second terminal extend from the housing in a same direction.

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