The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Aug. 28, 2017
Applicant:
Olympus Corporation, Hachioji-shi, Tokyo, JP;
Inventor:
Keigo Ito, Minowa-machi, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/50 (2006.01); H01L 23/525 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49572 (2013.01); H01L 21/4803 (2013.01); H01L 21/4821 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/49861 (2013.01); H01L 23/50 (2013.01); H01L 23/525 (2013.01);
Abstract
A molded interconnect device adapted to form a three-dimensional circuit by using laser beams includes: a main body on which the three-dimensional circuit is formed; and a lead portion connected to an external electrode of an external substrate by solder and extending from the main body. The lead portion includes: a lead main body molded from a material same as a material of the main body; and a metal film formed on at least a part of an outer periphery of the lead main body.
Ito, Keigo. (2019). Molded interconnect device, manufacturing method for molded interconnect device, and circuit module (U.S. Patent No. 10304762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10304762
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile