The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Apr. 26, 2016
Applicant:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, 's-Gravenhage, NL;

Inventors:

Rob Jacob Hendriks, 's-Gravenhage, NL;

Daan Anton van den Ende, 's-Gravenhage, NL;

Edsger Constant Pieter Smits, 's-Gravenhage, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/683 (2006.01); H01L 21/677 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67356 (2013.01); H01L 21/67751 (2013.01); H01L 21/683 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2021/60007 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/1131 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7526 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/75502 (2013.01); H01L 2224/75611 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/8123 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/97 (2013.01);
Abstract

A method and apparatus for soldering a chip () to a substrate (). A chip carrier () is provided between a flash lamp () and the substrate (). The chip () is attached to the chip carrier () on a side of the chip carrier () facing the substrate (). A solder material () is disposed between the chip () and the substrate (). The flash lamp () generates a light pulse () for heating the chip (). The heating of the chip () causes the chip () to be released from the chip carrier () towards the substrate (). The solder material () is at least partially melted by contact with the heated chip () for attaching the chip () to the substrate ().


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