The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

May. 26, 2017
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Inventor:

Jingang Hao, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); G02F 1/1362 (2006.01); H01L 27/12 (2006.01); G02F 1/1368 (2006.01); G02F 1/1343 (2006.01); H01L 23/62 (2006.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28 (2013.01); G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); G02F 1/134363 (2013.01); G02F 1/136204 (2013.01); G02F 1/136286 (2013.01); H01L 21/311 (2013.01); H01L 21/3213 (2013.01); H01L 21/67396 (2013.01); H01L 23/62 (2013.01); H01L 27/12 (2013.01); H01L 27/1244 (2013.01); G02F 1/136227 (2013.01); G02F 2001/13629 (2013.01); G02F 2001/13685 (2013.01); G02F 2001/136295 (2013.01); G02F 2201/121 (2013.01); G02F 2201/123 (2013.01);
Abstract

An array substrate, a fabricating method thereof, and a related display device are provided. The method for forming an array substrate can comprises: forming a plurality of signal lines over a base substrate; forming a conductive line over the base substrate, the conductive line connecting at least two of the plurality of signal lines; forming an insulating layer over the base substrate, the plurality of signal lines, and the conductive line; forming a via hole through the insulating layer at a position over the conductive line and between the at least two of the plurality of signal lines; and removing a portion of the conductive line through the via hole to disconnect the conductive line.


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