The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Mar. 19, 2018
Applicant:

Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R.o.c, Taoyuan, TW;

Inventors:

Wen-Hsiang Huang, Taoyuan, TW;

Chih-Hung Wu, Taoyuan, TW;

Hwen-Fen Hong, Taoyuan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/02 (2006.01); H01L 21/02 (2006.01); C30B 25/10 (2006.01); C30B 29/44 (2006.01); C30B 29/68 (2006.01); C30B 25/18 (2006.01); C30B 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02543 (2013.01); C30B 25/02 (2013.01); C30B 25/10 (2013.01); C30B 25/183 (2013.01); C30B 29/40 (2013.01); C30B 29/44 (2013.01); C30B 29/68 (2013.01); H01L 21/0251 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02392 (2013.01); H01L 21/02461 (2013.01);
Abstract

The present invention provides a method for fabricating an InGaP epitaxial layer by metal organic chemical vapor deposition (MOCVD). The method comprises: placing a silicon substrate in a reaction chamber; arranging the reaction chamber to have a first chamber temperature, and growing a first GaP layer with a first thickness on the Si substrate at the first chamber temperature; arranging the reaction chamber to have a second chamber temperature, and growing a second GaP layer with a second thickness on the first GaP layer at the second chamber temperature; arranging the reaction chamber to have a third chamber temperature for a first time interval, and then arranging the reaction chamber to have a fourth chamber temperature for a second time interval; and growing a multi-layered InGaP layer on the second GaP layer.


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