The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Jul. 21, 2015
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Mitsunori Inoue, Nagaokakyo, JP;
Tomohiko Mori, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/002 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01); C09D 183/00 (2006.01); C09D 133/00 (2006.01); C09D 127/08 (2006.01); C09D 163/00 (2006.01); C25D 5/34 (2006.01); H01C 7/10 (2006.01); H01C 1/14 (2006.01); H01C 7/02 (2006.01); H01C 7/04 (2006.01); H01C 17/28 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01); C09D 133/08 (2006.01); H01F 17/00 (2006.01); H01G 4/008 (2006.01); C25D 5/02 (2006.01); C25D 5/12 (2006.01); C09D 183/04 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); C09D 133/08 (2013.01); C09D 163/00 (2013.01); C25D 5/34 (2013.01); H01C 1/1406 (2013.01); H01C 1/1413 (2013.01); H01C 7/021 (2013.01); H01C 7/041 (2013.01); H01C 7/10 (2013.01); H01C 17/281 (2013.01); H01F 17/0033 (2013.01); H01G 4/1209 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01); C09D 183/04 (2013.01); C25D 5/022 (2013.01); C25D 5/12 (2013.01); H01G 4/0085 (2013.01);
Abstract
A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes that are provided on the surface of the ceramic element. The coating film is selectively formed on the surface of the ceramic element by applying, to the ceramic electronic component, a resin-containing solution containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid.