The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Mar. 20, 2014
Applicant:

Enpirion, Inc., Hampton, NJ (US);

Inventors:

Ashraf W. Lotfi, Bridgewater, NJ (US);

Mathew A. Wilkowski, Nazareth, PA (US);

Trifon M. Liakopoulos, Bridgewater, NJ (US);

John D. Weld, Ledgewood, NJ (US);

Assignee:

Enpirion, Inc., Hampton, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 27/29 (2006.01); H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 17/04 (2006.01); H01L 23/495 (2006.01); H01L 25/16 (2006.01); H02M 3/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2847 (2013.01); H01F 17/04 (2013.01); H01L 23/495 (2013.01); H01L 25/16 (2013.01); H02M 3/00 (2013.01); H01F 2027/2814 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49096 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49073 (2015.01); Y10T 29/49076 (2015.01); Y10T 29/49121 (2015.01); Y10T 29/49146 (2015.01);
Abstract

A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.


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