The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Dec. 05, 2017
Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;
Hisense Usa Corp., Suwanee, GA (US);
Hisense International Co., Ltd., Qingdao, Shandong, CN;
Hao Wang, Shandong, CN;
Hongwei Mu, Shandong, CN;
YongLiang Huang, Shandong, CN;
Shun Zhang, Shandong, CN;
HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Qingdao, CN;
HISENSE USA CORP., Suwanee, GA (US);
HISENSE INTERNATIONAL CO., LTD., Qingdao, CN;
Abstract
An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.