The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Mar. 03, 2017
Method for carrying out a sound test of atleast one component and endoscope device used for the same
Siemens Aktiengesellschaft, München, DE;
Henning Almstedt, Mülheim an der Ruhr, DE;
Ralf Bell, Mülheim an der Ruhr, DE;
Ulrich Beul, Essen, DE;
Kai Brune, Rheinberg, DE;
Robin Burzan, Mülheim an der Ruhr, DE;
Matthias Heue, Bochum, DE;
Benedikt Hofmeister, Mülheim, DE;
Mario Koebe, Mülheim an der Ruhr, DE;
Michael Löhr, Mülheim an der Ruhr, DE;
Stefan Riemann, Kaarst, DE;
Andreas Schaarschmidt, Essen, DE;
Andreas Ulma, Mülheim an der Ruhr, DE;
Sebastian Zahn, Duisburg, DE;
Gerta Zimmer, Mülheim an der Ruhr, DE;
Siemens Aktiengesellschaft, , DE;
Abstract
A method is provided for carrying out a sound test for detecting and/or analyzing material faults and/or mounting faults of at least one component, in which the component is excited, by striking, to experience vibrations which generate soundwaves, after which the generated soundwaves are detected and conclusions are drawn about material faults and/or mounting faults on the basis of the detected soundwaves, wherein the striking of the component and the detection of the vibrations are carried out using an endoscope device. In addition, embodiments of the present invention relates to an endoscope device which is configured to carry out the method.