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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10302506 B1

PDFFull Text
Expired
Date of Patent:
May. 28, 2019

Filed:

Feb. 05, 2015

Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor

Applicant:

Japan Science and Technology Agency, Hon-cho, Kawaguchi-shi, Saitama, JP;

Inventors:

Tsuyoshi Sekitani, Osaka, JP;

Yuki Terakawa, Tokyo, JP;

Tomoyuki Yokota, Tokyo, JP;

Takao Someya, Tokyo, JP;

Jonathan T. Reeder, Richardson, TX (US);

Assignee:

JAPAN SCIENCE AND TECHNOLOGY AGENCY, Kawaguchi-Shi, JP;

Attorney:
Primary Examiner:

Jonathan M Dunlap

Assistant Examiner:

Philip L Cotey

Int. Cl.
CPC ...
G01K 7/22 (2006.01); C08F 220/18 (2006.01); C08K 3/04 (2006.01); C08L 33/08 (2006.01); H01C 7/02 (2006.01); H01C 17/065 (2006.01); C09D 7/61 (2018.01); C09D 5/24 (2006.01); C09D 133/08 (2006.01); H01C 17/06 (2006.01);
U.S. Cl.
CPC ...
G01K 7/22 (2013.01); C08F 220/18 (2013.01); C08K 3/04 (2013.01); C08L 33/08 (2013.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 133/08 (2013.01); H01C 7/022 (2013.01); H01C 7/027 (2013.01); H01C 17/06 (2013.01); H01C 17/06586 (2013.01); C08F 2220/1891 (2013.01); C08K 2201/001 (2013.01);
Abstract

In order to provide a resin composition for temperature sensors that includes a polymer and exhibits high flexibility, higher sensitivity and high cyclic repeatability, a temperature sensor element, a temperature sensor, and a method for producing a temperature sensor, the resin composition () for temperature sensors is configured to have conductive particles () dispersed in an acrylic polymer () obtained by copolymerizing a first acrylic monomer represented by a general formula CHCHCOOXand a second acrylic monomer represented by a general formula CHCHCOOX.

Find Patent Forward Citations

Sekitani, Tsuyoshi. (2019). Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor (U.S. Patent No. 10302506). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10302506

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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