The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Nov. 14, 2014
Applicant:

Endress + Hauser Gmbh + Co. KG, Maulburg, DE;

Inventors:

Michael Dotsch, Rickenbach, DE;

Franco Ferraro, Schopfheim, DE;

Philipp Walser, Lorrach, DE;

Andreas Krumbholz, Maulburg, DE;

Robert Schmidt, Schopfheim, DE;

Assignee:

ENDRESS+HAUSER SE+CO. KG, Maulburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 23/00 (2006.01); G01F 23/296 (2006.01);
U.S. Cl.
CPC ...
G01F 23/2966 (2013.01); G01F 23/00 (2013.01); G01F 23/2967 (2013.01); G01F 23/2968 (2013.01);
Abstract

A system for determining and/or monitoring a process variable of a medium in a container, comprising a sensor module with an oscillatable unit, which is arranged in such a manner in the container that the oscillatable unit extends to a defined immersion depth in the medium, or that the oscillatable unit is placed at the height of the predetermined fill level, a tubular extension and/or a temperature reduction unit of a defined length, a contacting module and an electronics module, composed of an exciter/receiving unit, which excites the oscillatable unit to execute oscillations and receives the oscillations of the oscillatable unit. Two electrical coupling paths are associated with the electronics module, and a control/evaluation unit, which based on at least one oscillation variable of the oscillations or based on a change of an oscillation variable of the oscillations, provides information concerning the process variable or the reaching of the predetermined fill level. The sensor module and the electronics module are either electrically connected directly with one another, wherein one of the two electrical coupling paths is activated, or wherein the sensor module and the electronics module are indirectly electrically connected with one another via the contacting module, and wherein both coupling paths are activated.


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