The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Oct. 04, 2016
Applicant:

Digital Electronics Corporation, Osaka, JP;

Inventors:

Yuji Ganaha, Osaka, JP;

Daisuke Nishimatsu, Komaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 25/12 (2006.01); F21V 8/00 (2006.01); H01L 33/32 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); C09D 133/14 (2006.01); F21Y 115/10 (2016.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
F21V 25/12 (2013.01); C09D 133/14 (2013.01); G02B 6/0073 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 33/32 (2013.01); H01L 33/504 (2013.01); H01L 33/60 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A light source device includes a LED package, a container where the LED package is arranged and that is filled with nitrogen gas, and a fluorine-based coating film applied on a surface of the LED package and covering a light exit surface of the LED package. The LED package includes a LED element, a base board on which the LED element is mounted, a peripheral wall portion surrounding the LED element and extending from the base board, sealing resin disposed in an inner space within the peripheral wall portion such that the LED element is sealed with the sealing resin, and the light exit surface that is a surface of the sealing resin surrounded by the peripheral wall portion. Light from the LED element is exited outside the sealing resin through the light exit surface.


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