The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Oct. 04, 2016
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Kimihiro Aoyama, Tokyo, JP;

Nobuo Tajima, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/04 (2006.01); C11D 3/06 (2006.01); C11D 3/39 (2006.01); C11D 3/395 (2006.01); C11D 11/00 (2006.01); C11D 3/33 (2006.01); C11D 3/00 (2006.01); C11D 7/04 (2006.01); C11D 7/06 (2006.01); C11D 7/36 (2006.01); H01L 21/02 (2006.01); H01L 21/3213 (2006.01); C11D 7/10 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); C11D 3/0073 (2013.01); C11D 3/044 (2013.01); C11D 3/33 (2013.01); C11D 3/3902 (2013.01); C11D 3/3942 (2013.01); C11D 3/3947 (2013.01); C11D 7/04 (2013.01); C11D 7/06 (2013.01); C11D 7/10 (2013.01); C11D 7/36 (2013.01); H01L 21/02068 (2013.01); H01L 21/32134 (2013.01); H01L 21/31144 (2013.01);
Abstract

Liquid cleaning compositions for removing a titanium nitride hard mask while suppressing damage to copper, a copper alloy, cobalt or a cobalt alloy upon fabricating a semiconductor device, a cleaning method using the same, and a method for fabricating a semiconductor device, which comprise hydrogen peroxide at 1-30% by mass, potassium hydroxide at 0.01-1% by mass, aminopolymethylene phosphonic acid at 0.0001-0.05% by mass, a compound having a group 13 element at 0.00005-0.5% by mass, and water.


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