The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Mar. 29, 2017
Applicant:
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Inventors:
Akinori Inoue, Tokyo, JP;
Shozo Takada, Tokyo, JP;
Assignee:
ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08G 59/20 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); C09K 3/10 (2006.01); C08K 3/36 (2006.01); H01L 21/56 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C09K 3/10 (2013.01); C08G 59/20 (2013.01); C08G 59/50 (2013.01); C08K 3/013 (2018.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); C08K 2201/005 (2013.01); C09K 2003/1078 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract
A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: