The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Feb. 16, 2016
Applicants:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Bo Xia, Irvine, CA (US);

Rudolf W. Oldenzijl, Hoogezand, NL;

Jianping Chen, Irvine, CA (US);

Gunther Dreezen, Balen Olmen, BE;

Assignees:

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 5/24 (2006.01); H01B 1/02 (2006.01); H01B 1/22 (2006.01); H05K 1/09 (2006.01); C09D 11/10 (2014.01); C22C 5/06 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C09D 5/24 (2013.01); C09D 11/10 (2013.01); C22C 5/06 (2013.01); G06F 3/0412 (2013.01); H01B 1/02 (2013.01); H01B 1/22 (2013.01); H05K 1/095 (2013.01); H05K 1/097 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/10128 (2013.01);
Abstract

Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate.


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