The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Apr. 20, 2017
Applicant:

Toledo Molding & Die, Inc., Toledo, OH (US);

Inventors:

Erich James Vorenkamp, Pinckney, MI (US);

Charles David Satarino, Milan, MI (US);

Karthik S. Jayakumar, Canton, MI (US);

Christopher Paul Durand, Toledo, OH (US);

Peter Ermie, Jr., Perrysburg, OH (US);

Assignee:

Toledo Molding & Die, Inc., Toledo, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B 1/26 (2006.01); B28B 1/52 (2006.01); B60H 1/00 (2006.01); D21J 1/04 (2006.01); D21J 3/04 (2006.01); D21J 7/00 (2006.01); B29K 105/06 (2006.01); B29C 47/00 (2006.01);
U.S. Cl.
CPC ...
B60H 1/00564 (2013.01); B29C 47/0054 (2013.01); D21J 3/04 (2013.01); D21J 7/00 (2013.01); B28B 1/26 (2013.01); B28B 1/52 (2013.01); B29K 2105/06 (2013.01); D21J 1/04 (2013.01);
Abstract

Disclosed is a method to form arbitrarily shaped, uniform, lightweight, thermally insulating and acoustically absorptive automotive components with controllable density, thickness, porosity, and surface integrity. The method is based on natural cellulosic fibers such as those found in cardboard and paper and uses a thermoplastic fiber and particle slurry to form fusible components. The method produces components having the benefit of commercially available thermoformed fiber mats or open-cell extruded foam components with excellent acoustical properties, enhanced thermal insulation, and are light weight, which limits engine inefficiency, and the high cost of such products so as to allow large scale implementation.


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