The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Jun. 29, 2018
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Peter James Fricke, Corvallis, OR (US);

Michael W. Cumbie, Albany, OR (US);

Scott A. Linn, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/0452 (2013.01); B41J 2/0458 (2013.01); B41J 2/04528 (2013.01); B41J 2/04543 (2013.01); B41J 2/04573 (2013.01); B41J 2/04596 (2013.01); B41J 2/04598 (2013.01); B41J 2202/13 (2013.01); B41J 2202/21 (2013.01);
Abstract

A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.


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