The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2019
Filed:
Jun. 17, 2014
Mitsubishi Heavy Industries, Ltd., Minato-ku, Tokyo, JP;
Tomohiro Murai, Tokyo, JP;
Masaaki Nishiguchi, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
This molding die used for molding a composite material comprises: a molding member having a molding surface; a support frame that is provided on the lower side of the molding member, and that supports the molding member; and a height adjustment mechanism that is provided between the molding member and the support frame, and that is capable of adjusting the height of the molding member with respect to the support frame. The thermal expansion coefficient of the molding member is less than or equal to the thermal expansion coefficient of the support frame. Three wheels that travel on a floor surface while supporting the support frame at three points are provided on the lower side of the support frame.