The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Aug. 29, 2014
Applicant:

Mitsubishi Gas Chemical Company, Inc, Tokyo, JP;

Inventors:

Kentaro Ishii, Kanagawa, JP;

Tomonori Kato, Kanagawa, JP;

Jun Mitadera, Kanagawa, JP;

Kenji Kouno, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 47/80 (2006.01); B29C 47/82 (2006.01); B29C 47/92 (2006.01); B29C 47/00 (2006.01); B29C 47/20 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
B29C 47/827 (2013.01); B29C 47/0023 (2013.01); B29C 47/0054 (2013.01); B29C 47/20 (2013.01); B29C 47/92 (2013.01); B29C 2947/92704 (2013.01); B29K 2023/065 (2013.01); B29K 2995/0067 (2013.01);
Abstract

The production method for a polyolefin-based structure of the present invention produces a polyolefin-based structure from a mixed source material containing a polyolefin (A), an acid-modified polyolefin (B) and a gas barrier resin (C) using a molding machine, under the condition mentioned below. The molding machineis equipped with a single-screw extruder, a die head, and an adaptorfor feeding the mixed source material from the single-screw extruderto the die head. Am+10° C.≤T≤Cm−10° C. (1), Cm−30° C.≤T≤Cm+30° C. (2), Cm−10° C.≤T≤Cm+50° C. (3), Cm−30° C.≤T≤Cm+30° C. (4). Tis a cylinder temperature in a section corresponding to a supply zoneA and a compression zoneB, Tis a cylinder temperature in a section corresponding to a metering zoneC, Tis a temperature of an adaptor, Tis a temperature of a die head, Am is the melting point of the component (A), and Cm is the melting point of the component (C).


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