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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10300554 B1

PDFFull Text
Date of Patent:
May. 28, 2019

Filed:

Dec. 20, 2017

Wafer alignment method and system

Applicant:

Illumina, Inc., San Diego, CA (US);

Inventors:

Peter Mains, San Diego, CA (US);

Anmiv S. Prabhu, San Diego, CA (US);

Richard Capella, San Diego, CA (US);

Kevan Samiee, San Diego, CA (US);

Assignee:

ILLUMINA, INC., San Diego, CA (US);

Attorney:

Illumina, Inc.

Primary Examiner:

Jacob T Minskey

Assistant Examiner:

Matthew Hoover

Int. Cl.
CPC ...
B23K 26/00 (2014.01); B29C 65/00 (2006.01); B23K 26/02 (2014.01); B23K 26/21 (2014.01); B29C 65/78 (2006.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/324 (2014.01); B23K 26/38 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/02 (2013.01); B23K 26/032 (2013.01); B23K 26/0853 (2013.01); B23K 26/21 (2015.10); B23K 26/324 (2013.01); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B29C 65/7814 (2013.01); B23K 2101/40 (2018.08); B23K 2103/54 (2018.08);
Abstract

Wafers are aligned with one another by reference to features formed on or in each wafer. Notches are formed in each wafer, including a pivot-notch that allows for two-point contact, and a stop-notch that provides for single-point contact. A bias-notch is formed for pressing the wafers into engagement with the two-contact element when it is in the pivot-notch and with the single-contact element when it is in the stop-notch. The wafers may be bonded to one another to maintain the alignment of the referenced features.

Find Patent Forward Citations

Mains, Peter. (2019). Wafer alignment method and system (U.S. Patent No. 10300554). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10300554

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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