The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2019

Filed:

Jan. 13, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Kassy Moy Hart, Greenville, SC (US);

Sandip Dutta, Greenville, SC (US);

Srikanth Chandrudu Kottilingam, Greenville, SC (US);

David Edward Schick, Simpsonville, SC (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B23K 26/70 (2014.01); B29C 64/153 (2017.01); B23K 101/00 (2006.01); B29C 64/25 (2017.01); B29C 64/364 (2017.01); B33Y 10/00 (2015.01); B29C 64/245 (2017.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B23K 26/703 (2015.10); B29C 64/153 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 2003/1056 (2013.01); B23K 2101/001 (2018.08); B29C 64/245 (2017.08); B29C 64/25 (2017.08); B29C 64/364 (2017.08); B33Y 10/00 (2014.12); Y02P 10/295 (2015.11);
Abstract

This disclosure provides systems and tooling for cooling components during additive manufacturing. A build plate supports layers of powdered materials as they are positioned and selectively fused to create the component. The build plate defines a build surface and the build surface retracts in a working direction opposite a build direction for the component. At least one vertical cooling structure is provided perpendicular to the build plate and protruding from the build plate as the build surface retracts. The vertical cooling structure cools at least a portion of the component through unfused powdered materials between the vertical cooling structure and the component.


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