The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

May. 26, 2015
Applicant:

Amazon Technologies, Inc., Seattle, WA (US);

Inventors:

Shawn Duane Patrick, Issaquah, WA (US);

Frank Andrew Glynn, Leesburg, VA (US);

Alan Joseph Lachapelle, Reston, VA (US);

Giorgio Arturo Pompei, Seattle, WA (US);

Assignee:

Amazon Technologies, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20745 (2013.01); H05K 7/20145 (2013.01);
Abstract

A modular cooling apparatus for cooling one or more rack-mounted electronic component enclosures in a datacenter includes a base duct section and a duct assembly. The base duct section includes an inlet to receive a cooling airflow and an outlet to transfer to the cooling airflow to the duct assembly. The duct assembly is connected to the base duct section. The duct assembly includes one or more modular duct sections. Each of the one or more modular duct sections has a vent and is configured such that the vent aligns with an exterior opening in the respective one of the one or more electronic component enclosures.


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