The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Aug. 01, 2017
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventor:

Wei Shi, San Jose, CA (US);

Assignee:

FINISAR CORPORATION, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/363 (2013.01); H05K 3/36 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/49855 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/2036 (2013.01);
Abstract

In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad.


Find Patent Forward Citations

Loading…