The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
May. 04, 2016
Applicant:
Halliburton Energy Services, Inc., Houston, TX (US);
Inventors:
Andrew Albert Hrametz, Rosenberg, TX (US);
Alexander T. Duncan, Houston, TX (US);
Assignee:
Halliburton Energy Services, Inc., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); C22C 13/02 (2006.01); E21B 49/00 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3463 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); E21B 49/00 (2013.01); H05K 1/09 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
Hrametz, Andrew. (2019). Lead-free solder alloy for printed circuit board assemblies for high-temperature environments (U.S. Patent No. 10299388). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10299388
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile