The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Aug. 05, 2016
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Nobuaki Miyamoto, Ibaraki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 1/04 (2006.01); H05K 3/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); C25D 5/16 (2006.01); H05K 3/20 (2006.01); C25D 5/02 (2006.01); C25D 7/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/025 (2013.01); C25D 1/04 (2013.01); C25D 5/022 (2013.01); C25D 5/16 (2013.01); C25D 7/0614 (2013.01); H05K 1/0313 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/06 (2013.01); H05K 3/205 (2013.01); H05K 3/4038 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0769 (2013.01); H05K 2203/0307 (2013.01);
Abstract

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cmat 220° C. for 2 hours is 0.181 to 2.922 μm.


Find Patent Forward Citations

Miyamoto, Nobuaki. (2019). Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device (U.S. Patent No. 10299385). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10299385

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…