logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10299376 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Apr. 14, 2016

Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving object

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Hidefumi Nakamura, Hachinohe, JP;

Taku Kawasaki, Hachinohe, JP;

Assignee:

Seiko Epson Corporation, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Xiaoling Chen

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H01B 19/00 (2006.01); H05K 3/22 (2006.01); H03H 9/10 (2006.01); H01B 1/22 (2006.01); B22F 1/02 (2006.01); B22F 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/40 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); B22F 1/02 (2013.01); B22F 3/02 (2013.01); H01B 1/22 (2013.01); H01B 19/00 (2013.01); H03H 9/10 (2013.01); H05K 1/0373 (2013.01); H05K 3/105 (2013.01); H05K 3/22 (2013.01); H05K 3/4038 (2013.01); H05K 3/1216 (2013.01); H05K 2201/0224 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1126 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1136 (2013.01); H05K 2203/1461 (2013.01);
Abstract

A method for producing an electrical wiring member includes press-molding a composition containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle and a surface insulating layer covering the metal particle and containing a glass material as a main material, thereby obtaining a powder-compacted layer and irradiating the powder-compacted layer with an energy beam, thereby causing the irradiated regions to exhibit electrical conductivity.

Find Patent Forward Citations

Quick Actions:

Nakamura, Hidefumi. (2019). Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving object (U.S. Patent No. 10299376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10299376

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…