The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Apr. 14, 2016
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Hidefumi Nakamura, Hachinohe, JP;
Taku Kawasaki, Hachinohe, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H01B 19/00 (2006.01); H05K 3/22 (2006.01); H03H 9/10 (2006.01); H01B 1/22 (2006.01); B22F 1/02 (2006.01); B22F 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/40 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); B22F 1/02 (2013.01); B22F 3/02 (2013.01); H01B 1/22 (2013.01); H01B 19/00 (2013.01); H03H 9/10 (2013.01); H05K 1/0373 (2013.01); H05K 3/105 (2013.01); H05K 3/22 (2013.01); H05K 3/4038 (2013.01); H05K 3/1216 (2013.01); H05K 2201/0224 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1126 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1136 (2013.01); H05K 2203/1461 (2013.01);
Abstract
A method for producing an electrical wiring member includes press-molding a composition containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle and a surface insulating layer covering the metal particle and containing a glass material as a main material, thereby obtaining a powder-compacted layer and irradiating the powder-compacted layer with an energy beam, thereby causing the irradiated regions to exhibit electrical conductivity.