The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Feb. 08, 2017
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Wiring Systems, Limited, Yokkaichi-shi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Toshiyuki Tsuchida, Yokkaichi, JP;

Shigeki Yamane, Yokkaichi, JP;

Hirotoshi Maeda, Yokkaichi, JP;

Takuya Ota, Yokkaichi, JP;

Junya Aichi, Yokkaichi, JP;

Yoshihiro Tozawa, Yokkaichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H02G 3/16 (2006.01); H05K 1/18 (2006.01); H01F 27/36 (2006.01); H02G 3/03 (2006.01); H02G 3/08 (2006.01); H05K 1/02 (2006.01); B60R 16/023 (2006.01);
U.S. Cl.
CPC ...
H02G 3/16 (2013.01); H01F 27/36 (2013.01); H02G 3/03 (2013.01); H02G 3/081 (2013.01); H05K 1/0203 (2013.01); H05K 1/0216 (2013.01); H05K 1/184 (2013.01); H05K 9/0032 (2013.01); H05K 9/0037 (2013.01); B60R 16/0239 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/2018 (2013.01);
Abstract

An electrical junction box that includes a circuit board on which a coil element is installed; a partition wall that surrounds the coil element and separates an installation region on the circuit board on which the coil element is installed from a region around the installation region; a frame that is formed in one piece with the partition wall and surrounds the circuit board; a heat dissipation plate on which the circuit board and the frame are placed; and a cover that covers the circuit board from the frame side, wherein the coil element is fixed to the partition wall using a synthetic resin material, and wherein the frame and the heat dissipation plate are positioned relative to each other through a recess-projection engagement, and the cover is fixed to the heat dissipation plate using screws.


Find Patent Forward Citations

Loading…