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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10297832 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Nov. 19, 2015

System and method for manufacturing a micropillar array

Applicant:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, The Hague, NL;

Inventors:

Sandeep Unnikrishnan, The Hague, NL;

Rob Jacob Hendriks, The Hague, NL;

Assignee:

Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO, The Hague, NL;

Attorney:

Banner & Witcoff, Ltd.

Primary Examiner:

James M Erwin

Int. Cl.
CPC ...
H01M 4/70 (2006.01); B81C 1/00 (2006.01); C09D 11/52 (2014.01); C25D 7/00 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/09 (2006.01); G03F 7/095 (2006.01); H01M 4/04 (2006.01); G03F 7/20 (2006.01); G03F 7/36 (2006.01); G03F 7/40 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/70 (2013.01); B81C 1/00111 (2013.01); C09D 11/52 (2013.01); C25D 7/00 (2013.01); G03F 7/0037 (2013.01); G03F 7/0043 (2013.01); G03F 7/094 (2013.01); G03F 7/095 (2013.01); G03F 7/2004 (2013.01); G03F 7/36 (2013.01); H01M 4/0452 (2013.01); H01M 4/0471 (2013.01); B81B 2203/0361 (2013.01); G03F 7/40 (2013.01); H01M 2004/025 (2013.01);
Abstract

A system and method for manufacturing a micropillar array (). A carrier () is provided with a layer of metal ink (). A high energy light source () irradiates the metal ink () via a mask () between the carrier () and the light source. The mask is configured to pass a cross-section illuminated image of the micropillar array onto the metal ink (), thereby causing a patterned sintering of the metal ink () to form a first subsection layer () of the micropillar array () in the layer of metal ink (). A further layer of the metal ink () is applied on top of the first subsection layer () of the micropillar array () and irradiated via the mask () to form a second subsection layer () of the micropillar array on top. The process is repeated to achieve high aspect ratio micropillars

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