The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Nov. 17, 2017
Applicant:

Foshan Nationstar Optoeletronics Co., Ltd., Guangdong, CN;

Inventors:

Chuanbiao Liu, Guangdong, CN;

Hu Xu, Guangdong, CN;

Xiaofeng Liu, Guangdong, CN;

Zhuang Peng, Guangdong, CN;

Aidi Chen, Guangdong, CN;

Ling Li, Guangdong, CN;

Hongxin Chen, Guangdong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An LED device, a method for manufacturing an LED device, and an LED display module are provided. The LED device includes an LED bracket, an LED chip and an encapsulation sealant. The LED bracket includes a metal bracket and a cup cover encasing the metal bracket. The cup cover includes a reflective cup having a cavity. The LED chip is fixed in the cavity of the reflective cup. The cavity of the reflective cup is filled with the encapsulation sealant. The encapsulation sealant includes an under sealant and a surface sealant. The under sealant covers the LED chip, and the surface sealant covers the under sealant. The under sealant is a transparent layer. The surface sealant is a matte layer.


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