logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10297726 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Dec. 22, 2017

Filling material, resin composition, package, light-emitting device, and methods of manufacturing same

Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Yuji Akazawa, Tokushima, JP;

Koichi Okada, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:

Hunton Andrews Kurth LLP

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Aaron J Gray

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/00 (2006.01); C08K 3/34 (2006.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); C09C 1/28 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); C08K 3/34 (2013.01); C08K 9/02 (2013.01); C09C 1/28 (2013.01); H01L 33/60 (2013.01); C01P 2004/10 (2013.01); C01P 2004/54 (2013.01); C01P 2004/61 (2013.01); C01P 2006/60 (2013.01); C08K 2201/003 (2013.01); C08K 2201/004 (2013.01); C08K 2201/016 (2013.01); H01L 2933/0033 (2013.01);
Abstract

A filling material for a resin composition includes a base material and a coating material coating at least a portion of a surface of a particle of the base material. The base material comprises a first inorganic compound containing a Group II element. The coating material comprises a second inorganic compound containing the Group II element and is different from the first inorganic compound. A method of manufacturing the filling material is provided. A resin composition comprising the filling material, a package, a light-emitting device, and methods of manufacturing them are also provided.

Find Patent Forward Citations

Akazawa, Yuji. (2019). Filling material, resin composition, package, light-emitting device, and methods of manufacturing same (U.S. Patent No. 10297726). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10297726

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…