The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Mar. 14, 2018
Applicant:
Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;
Inventors:
Tzu-Chien Hung, Hsinchu, TW;
Ya-Chi Lien, Hsinchu, TW;
Assignee:
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC, Hsinchu Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 21/683 (2006.01); H01L 33/42 (2010.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 51/00 (2006.01); G09F 9/30 (2006.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 21/6836 (2013.01); H01L 33/42 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); G09F 9/301 (2013.01); G09G 2380/02 (2013.01); H01L 51/0097 (2013.01); H01L 2251/5338 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract
The present invention relates to a flexible light source structure. The flexible light source structure includes a flexible insulating layer, a conductive trace layer formed on the flexible insulating layer, a plurality of light emitting diodes formed on the conductive trace layer and a packaging layer. The packaging layer covers the light emitting diodes and filling the gaps between the light emitting diodes.