The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Mar. 21, 2018
Applicant:

Light to Form, Llc, Northbrook, IL (US);

Inventors:

Shoubert Makanoeich, Saint Charles, IL (US);

Nelson Caldani, Richboro, PA (US);

Eric Bretschneider, Corinth, TX (US);

Assignee:

Light To Form, LLC, Northbrook, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 33/50 (2010.01); H01L 33/08 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H05B 33/08 (2006.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/0753 (2013.01); H01L 33/504 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H05B 33/0827 (2013.01); H05B 33/0857 (2013.01); H01L 33/32 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/644 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A LED device is disclosed. The device has a LED area, a boundary element surrounding the LED area, a plurality of chip scale package LEDs in the LED area, a plurality of flip chip LEDs in the LED area, an encapsulate, a first conductive path, and a second conductive. The encapsulate covers the plurality of chip scale package LEDs and the plurality of flip chip LEDs in the LED area. The encapsulate has phosphor. The first conductive path connects the plurality of chip scale package LEDs. The second conductive path connects the plurality of flip chip LEDs. The plurality of chip scale package LEDs and the plurality of flip chip LEDs in the LED area are arranged in rows. Each row comprises alternating chip scale package LEDs and flip chip LEDs.


Find Patent Forward Citations

Makanoeich, Shoubert. (2019). Chip on board led device and method (U.S. Patent No. 10297584). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10297584

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…