The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Sep. 30, 2015
Applicant:

Mc10, Inc., Lexington, MA (US);

Inventors:

Mitul Dalal, South Grafton, MA (US);

Sanjay Gupta, Bedford, MA (US);

Assignee:

MC10, INC., Lexington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/5385 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/48 (2013.01); H01L 24/50 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 24/95 (2013.01); H01L 25/50 (2013.01); H01L 23/5383 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/86 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/48499 (2013.01); H01L 2224/49176 (2013.01); H01L 2224/50 (2013.01); H01L 2224/73219 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85801 (2013.01); H01L 2224/86005 (2013.01); H01L 2224/86801 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/92248 (2013.01); H01L 2224/95 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/14 (2013.01);
Abstract

Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.


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