The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Apr. 25, 2018
Applicant:
The United States of America, As Represented BY the Secretary of the Navy, Washington, DC (US);
Inventors:
Scott A. Mathews, Takoma Park, MD (US);
Iyoel Beniam, Washington, DC (US);
Alberto Piqué, Crofton, MD (US);
Assignee:
The United States of America, as represented by the Secretary of the Navy, Washington, DC (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 21/4828 (2013.01); H01L 21/76885 (2013.01); H01L 24/05 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/43001 (2013.01); H01L 2224/435 (2013.01); H01L 2224/45012 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4805 (2013.01); H01L 2224/4814 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/85039 (2013.01); H01L 2224/8584 (2013.01); H01L 2224/8585 (2013.01); H01L 2924/00014 (2013.01);
Abstract
An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.