The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Apr. 25, 2017
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Assignee:
PANASONIC CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01F 38/14 (2006.01); H01L 23/522 (2006.01); H01L 25/00 (2006.01); H01P 1/201 (2006.01); H01P 5/02 (2006.01); H04B 5/00 (2006.01); H01L 23/49 (2006.01); H01P 1/203 (2006.01); H01L 21/56 (2006.01); H01P 7/08 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01F 38/14 (2013.01); H01L 23/49 (2013.01); H01L 23/495 (2013.01); H01L 23/49541 (2013.01); H01L 23/5227 (2013.01); H01L 25/00 (2013.01); H01P 1/201 (2013.01); H01P 1/20345 (2013.01); H01P 5/028 (2013.01); H04B 5/0025 (2013.01); H04B 5/0093 (2013.01); H01L 21/565 (2013.01); H01L 23/48 (2013.01); H01L 23/49551 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01079 (2013.01); H01P 7/08 (2013.01);
Abstract
A signal transmission apparatus includes: a first lead frame; a second lead frame spaced from the first lead frame; a primary semiconductor chip electrically connected to the first lead frame; a secondary semiconductor chip electrically connected to the second lead frame; and a signal isolator through which a signal is isolatedly transmitted from the primary semiconductor chip to the secondary semiconductor chip, the signal isolator having a first main surface that is bonded to both the first lead frame and the second lead frame.