The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Oct. 28, 2016
Applicant:

Byd Company Limited, Shenzhen, Guangdong, CN;

Inventors:

Qing Gong, Shenzhen, CN;

Yaxuan Sun, Shenzhen, CN;

Xinping Lin, Shenzhen, CN;

Shuming Zhao, Shenzhen, CN;

Bo Wu, Shenzhen, CN;

Jingjing Luo, Shenzhen, CN;

Donghai Cheng, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); H01L 25/07 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H01L 25/07 (2013.01); H01L 29/7393 (2013.01);
Abstract

A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S, and an area of a second portion of the first surface layer contacting each pin is denoted as S, in which 180≤S/S≤800, and 300≤N<650.


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