The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Apr. 26, 2016
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Yuuichi Abe, Satsumasendai, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); C22C 5/08 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); B22F 1/00 (2006.01); B22F 7/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); C22C 5/08 (2013.01); H01L 21/486 (2013.01); H01L 21/4871 (2013.01); H01L 23/15 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H05K 1/02 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); B22F 1/00 (2013.01); B22F 7/04 (2013.01); H01L 23/3677 (2013.01);
Abstract

A circuit substrate is provided with a base formed of ceramics. It includes a first face a second face; and a through hole penetrating from the first face to the second face; a through conductor: containing silver and copper as main components; disposed inside the through hole; and including a plurality of surfaces; and a metal layer in contact with at least one of the plurality of surfaces. The through conductor includes a eutectic region of silver and copper, disposed in a metal layer side of a diametrically center region of the through conductor; and a non-eutectic region of silver and copper, disposed in a central region of the diametrically center region of the through conductor.


Find Patent Forward Citations

Abe, Yuuichi. (2019). Circuit substrate, and electronic device including same (U.S. Patent No. 10297521). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10297521

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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