The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Feb. 18, 2015
Applicant:

Ipg Photonics Corporation, Oxford, MA (US);

Inventors:

Jeffrey P. Sercel, Hollis, NH (US);

Marco Mendes, Manchester, NH (US);

Jie Fu, Marlborough, MA (US);

Assignee:

IPG PHOTONICS CORPORATION, Oxford, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); B23K 26/40 (2014.01); H01L 21/78 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01); H01L 21/67 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7813 (2013.01); B23K 26/40 (2013.01); B32B 38/0008 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); H01L 21/67115 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); B32B 2457/14 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01);
Abstract

Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece. Consistent with at least one embodiment, a laser lift off system and method may be used to provide monolithic lift off of one or more epitaxial layers on a substrate of a semiconductor wafer.


Find Patent Forward Citations

Loading…