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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10297498 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Dec. 07, 2016

Method for preparing ceramic package substrate with copper-plated dam

Applicant:

Dongguan China Advanced Ceramic Technology Co., Ltd, Guangdong, CN;

Inventor:

Zhaohui Wu, Guangdong, CN;

Assignee:

DONGGUAN CHINA ADVANCED CERAMIC TECHNOLOGY CO., LTD., Dongguan, Guangdong, CN;

Attorney:

Leong C. Lei

Primary Examiner:

Alexander G Ghyka

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/70 (2006.01); H01L 21/203 (2006.01); H01L 21/48 (2006.01); H01L 21/3213 (2006.01); H01L 23/15 (2006.01); H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76873 (2013.01); H01L 21/203 (2013.01); H01L 21/3213 (2013.01); H01L 21/48 (2013.01); H01L 21/4846 (2013.01); H01L 21/707 (2013.01); H01L 23/15 (2013.01); H01L 23/49 (2013.01);
Abstract

A method for preparing a ceramic package substrate with a copper-plated dam involves making a circuit layer on a ceramic base by performing thin film metallization, dry film application, exposure, development, copper plating, and evening, and then forming copper-plated dams that circle individual circuits by repeatedly applying dry film application, exposure, development, and electroplating for thickening, so as to obtain the ceramic package substrate with the copper-plated dam. Circuits made using the method feature for high dimensional precision, high line resolution, and high surface evenness.

Find Patent Forward Citations

Wu, Zhaohui. (2019). Method for preparing ceramic package substrate with copper-plated dam (U.S. Patent No. 10297498). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10297498

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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