The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Oct. 03, 2014
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H03H 9/64 (2006.01); H03H 9/10 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/29 (2006.01); H03H 3/08 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/29 (2013.01); H01L 24/97 (2013.01); H03H 3/08 (2013.01); H03H 9/1085 (2013.01); H03H 9/64 (2013.01); H01L 23/3121 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01);
Abstract
Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25° C. The tack is measured, using a probe having a diameter of 25 mm.