The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Oct. 20, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jeffrey W. Anthis, San Jose, CA (US);

Benjamin Schmiege, Santa Clara, CA (US);

David Thompson, San Jose, CA (US);

Assignee:

Applied Materials Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); C23F 1/00 (2006.01); H01J 37/32 (2006.01); C23F 1/12 (2006.01); C23F 4/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32136 (2013.01); C23F 1/00 (2013.01); C23F 1/12 (2013.01); C23F 4/00 (2013.01); H01J 37/32715 (2013.01); H01J 37/32862 (2013.01); H01L 21/32135 (2013.01);
Abstract

Provided are methods for etching films comprising transition metals. Certain methods involve activating a substrate surface comprising at least one transition metal, wherein activation of the substrate surface comprises exposing the substrate surface to heat, a plasma, an oxidizing environment, or a halide transfer agent to provide an activated substrate surface; and exposing the activated substrate surface to a reagent comprising a Lewis base or pi acid to provide a vapor phase coordination complex comprising one or more atoms of the transition metal coordinated to one or more ligands from the reagent. Certain other methods provide selective etching from a multi-layer substrate comprising two or more of a layer of Co, a layer of Cu and a layer of Ni.


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