The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Aug. 28, 2015
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventor:
Mitsuhito Takahashi, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01); H01L 21/3105 (2006.01); H01L 21/762 (2006.01); C09G 1/00 (2006.01); C09G 1/02 (2006.01); C09G 1/04 (2006.01); C09G 1/12 (2006.01); C09K 3/14 (2006.01); C01F 17/00 (2006.01); C23F 3/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); C01F 17/0043 (2013.01); C09G 1/00 (2013.01); C09G 1/02 (2013.01); C09G 1/04 (2013.01); C09G 1/12 (2013.01); C09K 3/1463 (2013.01); C23F 3/04 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/76224 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01);
Abstract
The present invention provides a CMP polishing agent containing polishing particles, a protective agent, and water, wherein the protective agent is a silsesquioxane polymer having a polar group. This provides a CMP polishing agent which can reduce polishing scratches produced due to polishing in a CMP process and has high polishing selectivity.