The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Dec. 27, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Koki Shibuya, Nagaokakyo, JP;

Hirokazu Takashima, Nagaokakyo, JP;

Akio Masunari, Nagaokakyo, JP;

Tomoyuki Nakamura, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 3/22 (2006.01); H01G 4/40 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01G 4/005 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01); H03H 1/00 (2006.01); H03H 7/01 (2006.01); H05K 1/18 (2006.01); H01F 17/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01G 4/40 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01G 4/005 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H03H 1/00 (2013.01); H03H 1/0007 (2013.01); H03H 7/0115 (2013.01); H05K 1/181 (2013.01); H01F 2017/0026 (2013.01); H01F 2027/2809 (2013.01); H03H 2001/0021 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A composite electronic component includes a substrate with a first main surface and a side end surface, a first electronic component including external electrodes and mounted on the first main surface of the substrate, a second electronic component including external electrodes and being different in electrical function from the first electronic component mounted on the first main surface of the substrate, and a conductive pattern on the first main surface of the substrate, electrically connecting the first electronic component and the second electronic component to each other, and including one end reaching a side of one side end of the substrate, one external electrode of the first electronic component and one external electrode of the second electronic component being located on the side of the one side end of the substrate, another external electrode of the first electronic component and another external electrode of the second electronic component being connected to the conductive pattern, and the composite electronic component being mounted such that a surface of the substrate on the side of the one side end is opposed to a first main surface of a mount substrate.


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