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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10297363 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Sep. 17, 2015

Composition for forming conductive pattern and resin structure having conductive pattern

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Shin Hee Jun, Daejeon, KR;

Dae Ki Lee, Daejeon, KR;

Se Hui Sohn, Daejeon, KR;

Han Nah Jeong, Daejeon, KR;

Cheol-Hee Park, Daejeon, KR;

Chee-Sung Park, Daejeon, KR;

Jae Hyun Kim, Daejeon, KR;

Ha Na Lee, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Gerard Higgins

Int. Cl.
CPC ...
H01B 5/14 (2006.01); H01B 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); C08J 7/12 (2006.01); C08K 3/32 (2006.01); C08L 69/00 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/40 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
H01B 5/14 (2013.01); C08J 7/123 (2013.01); C08K 3/32 (2013.01); C08L 69/00 (2013.01); C23C 18/1641 (2013.01); C23C 18/204 (2013.01); C23C 18/405 (2013.01); H01B 1/026 (2013.01); H01B 1/22 (2013.01); H05K 1/0313 (2013.01); H05K 1/0373 (2013.01); H05K 3/105 (2013.01); H05K 3/182 (2013.01); C08J 2369/00 (2013.01); C08J 2483/04 (2013.01); C08K 2003/328 (2013.01); C08L 2203/20 (2013.01); C08L 2205/06 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0236 (2013.01); H05K 2203/072 (2013.01); H05K 2203/107 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/24917 (2015.01);
Abstract

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.

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Jun, Shin. (2019). Composition for forming conductive pattern and resin structure having conductive pattern (U.S. Patent No. 10297363). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10297363

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