The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Oct. 15, 2015
Applicant:

Sap SE, Walldorf, DE;

Inventors:

Meilin Bai, Shanghai, CN;

Xingtian Shi, Shanghai, CN;

Wen-Syan Li, Shanghai, CN;

Assignee:

SAP SE, Walldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06N 5/04 (2006.01); G06F 16/35 (2019.01); G06F 17/27 (2006.01);
U.S. Cl.
CPC ...
G06N 5/04 (2013.01); G06F 16/353 (2019.01); G06F 17/2745 (2013.01); G06F 17/2785 (2013.01);
Abstract

A system and method for analyzing documents, such as posts, on-line reviews and comments from people based on topics of the documents, to determine general sentiment of users is disclosed. Topics from the documents and their corresponding sentiment polarities are extracted. The documents are regarded to be constituted by a series of topics. The sentiment for a topic is represented by a quadruple (k, so, h, i), where k is the topic, so is the sentiment opinion, h is the comment or post holder, and i is the document. A quintuple (k, sup, p, n, ne) is used to illustrate the topics and corresponding sentiments and is stored in S, where sup indicates the frequency of the topic, and p (positive), n (negative) and ne (neutral) are different types of opinions of the users. From the quintuple set S, every topic is related to three kinds of sentiment opinions (positive, negative, and neutral), enabling determination of popular topics in documents as well as the users' sentiment polarities.


Find Patent Forward Citations

Loading…